Effects of rare earth Ce addition on the microstructure and shear property of Cu/In-50Ag/Cu composite solder joint
| Autor: | Yang, Li, Qiao, Jian, Zhang, Yaocheng, Gao, Huiming, Yao, Zengjian, Xu, Feng |
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| Zdroj: | In Microelectronics Reliability December 2021 127 |
| Databáze: | ScienceDirect |
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