Automated quantitative analysis of void morphology evolution in Ag[sbnd]Ag direct bonding interface after accelerated aging
| Autor: | Yu, Z., Xu, T., Letz, S., Bayer, C.F., Schletz, A., März, M. |
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| Zdroj: | In Microelectronics Reliability November 2021 126 |
| Databáze: | ScienceDirect |
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