Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
| Autor: | Malik, Muhammad Hassan, Grosso, Giovanna, Zangl, Hubert, Binder, Alfred, Roshanghias, Ali |
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| Zdroj: | In Microelectronics Reliability August 2021 123 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect