Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates
| Autor: | Okoro, Chukwudi, Jayaraman, Shrisudersan, Pollard, Scott |
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| Zdroj: | In Microelectronics Reliability May 2021 120 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect