Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process
| Autor: | Ohguro, T., Yagi, Y., Kimura, K., Kashiura, Y., Morioka, J., Matsuda, M., Yoshida, K., Takahashi, M., Ishiguro, A., Yamada, M., Urata, S., Tamura, T., Fuji, Y., Kamakura, T., Ohtsuka, K., Takano, A., Umekawa, S. |
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| Zdroj: | In Microelectronics Reliability November 2020 114 |
| Databáze: | ScienceDirect |
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