Bending reliability of Ni–MWCNT composite solder with a differential structure
| Autor: | Lee, Choong-Jae, Hwang, Byeong-Uk, Min, Kyung Deuk, Kim, Jae-Ha, Jung, Seung-Boo |
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| Zdroj: | In Microelectronics Reliability October 2020 113 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect