Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments
| Autor: | Ross, Nick, Asokan, Muthappan, Ashok Kumar, Goutham Issac, Caperton, Joshua, Alptekin, John, Salunke, Ashish Shivaji, Chyan, Oliver M. |
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| Zdroj: | In Microelectronics Reliability October 2020 113 |
| Databáze: | ScienceDirect |
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