Effects of solder degradation on the die temperature measurement via internal gate resistance

Autor:	Kawahara, C., Brandelero, J., Pichon, P., Mollov, S.
Zdroj:	In Microelectronics Reliability November 2020 114
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect