Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components
| Autor: | Ben Romdhane, E., Guédon-Gracia, A., Pin, S., Roumanille, P., Frémont, H. |
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| Zdroj: | In Microelectronics Reliability November 2020 114 |
| Databáze: | ScienceDirect |
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