The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
| Autor: | Liu, Zhi-Quan, Meng, Zhi-Chao, Wu, Di, Shang, Zhengang, He, Xin, Xiong, Xiaodong |
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| Zdroj: | In Microelectronics Reliability October 2020 113 |
| Databáze: | ScienceDirect |
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