Defect inspection of flip chip solder joints based on non-destructive methods: A review
| Autor: | Su, Lei, Yu, Xiaonan, Li, Ke, Pecht, Michael |
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| Zdroj: | In Microelectronics Reliability July 2020 110 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Su, Lei, Yu, Xiaonan, Li, Ke, Pecht, Michael |
|---|---|
| Zdroj: | In Microelectronics Reliability July 2020 110 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect