Implementation of a new thermal path within the structure of inorganic encapsulated power modules
| Autor: | Behrendt, S., Eisele, R., Scheibel, M.G., Kaessner, S. |
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| Zdroj: | In Microelectronics Reliability September 2019 100-101 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect