Reliability of pressure-free Cu nanoparticle joints for power electronic devices
| Autor: | Yamada, Y., Hasegawa, K., Ikeda, Y., Kasagi, Y., Katagiri, K., Katou, H., Watanabe, H., Takenaka, A., Nagata, H., Sekine, N., Sano, Y. |
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| Zdroj: | In Microelectronics Reliability September 2019 100-101 |
| Databáze: | ScienceDirect |
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