Power cycling and temperature endurance test of a GaN switching cell with substrate integrated chips

Autor:	Dechant, E., Seliger, N., Kennel, R.
Zdroj:	In Microelectronics Reliability September 2019 100-101
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect