Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
| Autor: | Zheng, Zeyang, Chiang, Ping-Chen, Huang, Yu-Ting, Wang, Wei-Ting, Li, Po-Chien, Tsai, Ya-Hui, Chen, Chih-Ming, Feng, Shien-Ping |
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| Zdroj: | In Microelectronics Reliability August 2019 99:44-51 |
| Databáze: | ScienceDirect |
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