Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
| Autor: | Panchenko, Iuliana, Wolter, Klaus-Juergen, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Beyne, Eric, Wolf, M. Juergen |
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| Zdroj: | In Microelectronics Reliability November 2019 102 |
| Databáze: | ScienceDirect |
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