Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)
| Autor: | Manoharan, Subramani, Patel, Chandradip, Dunford, Steven, Beshears, John, McCluskey, Patrick |
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| Zdroj: | In Microelectronics Reliability August 2019 99:137-151 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect