Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient
| Autor: | Liang, S.B., Ke, C.B., Huang, J.Q., Zhou, M.B., Zhang, X.P. |
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| Zdroj: | In Microelectronics Reliability January 2019 92:1-11 |
| Databáze: | ScienceDirect |
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