Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
| Autor: | Oh, Gyung-Hwan, Joo, Sung-Jun, Jeong, Jae-Woo, Kim, Hak-Sung |
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| Zdroj: | In Microelectronics Reliability January 2019 92:63-72 |
| Databáze: | ScienceDirect |
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