Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
| Autor: | Herfurth, N., Wu, C., Beyreuther, A., Nakamura, T., De Wolf, I., Simon-Najasek, M., Altmann, F., Croes, K., Boit, C. |
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| Zdroj: | In Microelectronics Reliability January 2019 92:73-78 |
| Databáze: | ScienceDirect |
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