TCAD modeling for reliability
| Autor: | Pfäffli, P., Wong, H.Y., Xu, X., Silvestri, L., Lin, X.W., Yang, T., Tiwari, R., Mahapatra, S., Motzny, S., Moroz, V., Ma, T. |
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| Zdroj: | In Microelectronics Reliability September 2018 88-90:1083-1089 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect