Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects – A novel approach for hybrid metal baseplates
| Autor: | Brincker, M., Kristensen, P.K., Söhl, S., Eisele, R., Popok, V.N. |
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| Zdroj: | In Microelectronics Reliability September 2018 88-90:774-778 |
| Databáze: | ScienceDirect |
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