A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits
Autor: | Bojita, Adrian, Boianceanu, Cristian, Purcar, Marius, Florea, Ciprian, Simon, Dan, Plesa, Cosmin-Sorin |
---|---|
Zdroj: | In Microelectronics Reliability August 2018 87:142-150 |
Databáze: | ScienceDirect |
Externí odkaz: |