A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits
| Autor: | Bojita, Adrian, Boianceanu, Cristian, Purcar, Marius, Florea, Ciprian, Simon, Dan, Plesa, Cosmin-Sorin |
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| Zdroj: | In Microelectronics Reliability August 2018 87:142-150 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect