Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder
| Autor: | Lee, Hyunju, Kim, Cheolmin, Heo, Cheolho, Kim, Chiho, Lee, Jae-Ho, Kim, Yangdo |
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| Zdroj: | In Microelectronics Reliability August 2018 87:75-80 |
| Databáze: | ScienceDirect |
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