Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
| Autor: | Dudek, R., Hildebrand, M., Rzepka, S., Fries, T., Döring, R., Seiler, B., Ortmann, R.W. |
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| Zdroj: | In Microelectronics Reliability April 2018 83:162-172 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect