Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies
| Autor: | d'Alessandro, Vincenzo, Catalano, Antonio Pio, Magnani, Alessandro, Codecasa, Lorenzo, Rinaldi, Niccolò, Moser, Brian, Zampardi, Peter J. |
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| Zdroj: | In Microelectronics Reliability November 2017 78:233-242 |
| Databáze: | ScienceDirect |
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