Qualification extension of automotive smart power and digital ICs to harsh aerospace mission profiles: Gaps and opportunities
| Autor: | Enrici Vaion, R., Medda, M., Mancaleoni, A., Mura, G., Pintus, A., De Tomasi, M. |
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| Zdroj: | In Microelectronics Reliability September 2017 76-77:438-443 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect