Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
| Autor: | Middendorf, A., Grams, A., Janzen, S., Lang, K.-D., Wittler, O. |
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| Zdroj: | In Microelectronics Reliability September 2017 76-77:450-454 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect