Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

Autor: Chen, C.Q., Ang, G.B., Ng, P.T., Rivai, Francis, Ng, H.P., Quah, A.C.T., Teo, Angela, Lam, Jeffery, Mai, Z.H.
Zdroj: In Microelectronics Reliability September 2017 76-77:261-266
Databáze: ScienceDirect