Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects
| Autor: | Liang, S.B., Ke, C.B., Ma, W.J., Zhou, M.B., Zhang, X.P. |
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| Zdroj: | In Microelectronics Reliability April 2017 71:71-81 |
| Databáze: | ScienceDirect |
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