Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
| Autor: | Ramli, M.I.I., Saud, N., Salleh, M.A.A. Mohd, Derman, M.N., Said, R. Mohd |
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| Zdroj: | In Microelectronics Reliability October 2016 65:255-264 |
| Databáze: | ScienceDirect |
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