Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
| Autor: | Auersperg, J., Collet, C., Dean, Th., Vogel, D., Winkler, Th. |
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| Zdroj: | In Microelectronics Reliability September 2016 64:665-668 |
| Databáze: | ScienceDirect |
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