Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis
| Autor: | Khaled, A., Brand, S., Kögel, M., Appenroth, T., De Wolf, I. |
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| Zdroj: | In Microelectronics Reliability September 2016 64:336-340 |
| Databáze: | ScienceDirect |
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