Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue

Autor:	Yap, H.H., Tan, P.K., Zhu, L., Feng, H., Zhao, Y.Z., He, R., Tan, H., Liu, B., Huang, Y.M., Wang, D.D., Lam, J., Mai, Z.H.
Zdroj:	In Microelectronics Reliability September 2016 64:357-361
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect