Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
| Autor: | Arabi, F., Theolier, L., Martineau, D., Deletage, J.-Y., Medina, M., Woirgard, E. |
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| Zdroj: | In Microelectronics Reliability September 2016 64:409-414 |
| Databáze: | ScienceDirect |
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