Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations
| Autor: | Choi, U.M., Blaabjerg, F., Jørgensen, S., Iannuzzo, F., Wang, H., Uhrenfeldt, C., Munk-Nielsen, S. |
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| Zdroj: | In Microelectronics Reliability September 2016 64:403-408 |
| Databáze: | ScienceDirect |
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