Failure mechanisms of microbolometer thermal imager sensors using chip-scale packaging
| Autor: | Elßner, Michael, Vogt, Holger |
|---|---|
| Zdroj: | In Microelectronics Reliability August-September 2015 55(9-10):1901-1905 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Elßner, Michael, Vogt, Holger |
|---|---|
| Zdroj: | In Microelectronics Reliability August-September 2015 55(9-10):1901-1905 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect