Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications
| Autor: | Sridhar, Ashok a, ⁎, Perinchery, Sandeep M. a, b, Smits, Edsger C.P. c, Mandamparambil, Rajesh d, van den Brand, Jeroen c |
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| Zdroj: | In Microelectronics Reliability November 2015 55(11):2324-2330 |
| Databáze: | ScienceDirect |
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