Intrinsic stress analysis of tungsten-lined open TSVs

Autor: Filipovic, Lado, Singulani, Anderson Pires, Roger, Frederic, Carniello, Sara, Selberherr, Siegfried
Zdroj: In Microelectronics Reliability August-September 2015 55(9-10):1843-1848
Databáze: ScienceDirect