Intrinsic stress analysis of tungsten-lined open TSVs
Autor: | Filipovic, Lado, Singulani, Anderson Pires, Roger, Frederic, Carniello, Sara, Selberherr, Siegfried |
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Zdroj: | In Microelectronics Reliability August-September 2015 55(9-10):1843-1848 |
Databáze: | ScienceDirect |
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