Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints
| Autor: | Qin, H.B., Zhang, X.P., Zhou, M.B., Li, X.P., Mai, Y.-W. |
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| Zdroj: | In Microelectronics Reliability July 2015 55(8):1214-1225 |
| Databáze: | ScienceDirect |
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