A new creep–fatigue life model of lead-free solder joint
| Autor: | Zhu, Yongxin, Li, Xiaoyan, Wang, Chao, Gao, Ruiting |
|---|---|
| Zdroj: | In Microelectronics Reliability June 2015 55(7):1097-1100 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
| Autor: | Zhu, Yongxin, Li, Xiaoyan, Wang, Chao, Gao, Ruiting |
|---|---|
| Zdroj: | In Microelectronics Reliability June 2015 55(7):1097-1100 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect