Microstructural evolution of ultrasonic-bonded aluminum wires
Autor: | Broll, Marian Sebastian a, ⁎, Geissler, Ute a, Höfer, Jan b, Schmitz, Stefan b, Wittler, Olaf b, Lang, Klaus Dieter a |
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Zdroj: | In Microelectronics Reliability May 2015 55(6):961-968 |
Databáze: | ScienceDirect |
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