Microstructural evolution of ultrasonic-bonded aluminum wires

Autor: Broll, Marian Sebastian a, ⁎, Geissler, Ute a, Höfer, Jan b, Schmitz, Stefan b, Wittler, Olaf b, Lang, Klaus Dieter a
Zdroj: In Microelectronics Reliability May 2015 55(6):961-968
Databáze: ScienceDirect