Local thickness and composition analysis of TEM lamellae in the FIB

Autor:	Lang, C., Hiscock, M., Dawson, M., Hartfield, C.
Zdroj:	In Microelectronics Reliability September-October 2014 54(9-10):1790-1793
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect