Modelling methodology for thermal analysis of hot solder dip process
| Autor: | Stoyanov, Stoyan, Bailey, Chris, Alam, M.O., Yin, Chunyan, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim |
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| Zdroj: | In Microelectronics Reliability August 2013 53(8):1055-1067 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect