Thermal resistance investigations on new leadframe-based LED packages and boards
| Autor: | Pardo, B., Gasse, A., Fargeix, A., Jakovenko, J., Werkhoven, R.J., Perpiñà, X., Jordà, X., Vellvehi, M., Van Weelden, T., Bancken, P. |
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| Zdroj: | In Microelectronics Reliability August 2013 53(8):1084-1094 |
| Databáze: | ScienceDirect |
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