Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps

Autor: Chang, Y.W., Peng, H.Y., Yang, R.W., Chen, Chih, Chang, T.C., Zhan, C.J., Juang, J.Y., Huang, Annie T.
Zdroj: In Microelectronics Reliability January 2013 53(1):41-46
Databáze: ScienceDirect