Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
Autor: | Chang, Y.W., Peng, H.Y., Yang, R.W., Chen, Chih, Chang, T.C., Zhan, C.J., Juang, J.Y., Huang, Annie T. |
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Zdroj: | In Microelectronics Reliability January 2013 53(1):41-46 |
Databáze: | ScienceDirect |
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