Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test
| Autor: | Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K. |
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| Zdroj: | In Microelectronics Reliability January 2013 53(1):70-78 |
| Databáze: | ScienceDirect |
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