High temperature storage reliability investigation of the Al–Cu wire bond interface
| Autor: | Pelzer, R., Nelhiebel, M., Zink, R., Wöhlert, S., Lassnig, A., Khatibi, G. |
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| Zdroj: | In Microelectronics Reliability September-October 2012 52(9-10):1966-1970 |
| Databáze: | ScienceDirect |
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