Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
| Autor: | Ivankovic, Andrej, Vanstreels, Kris, Vanderstraeten, Daniel, Brizar, Guy, Gillon, Renaud, Blansaer, Eddy, Vandevelde, Bart |
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| Zdroj: | In Microelectronics Reliability November 2012 52(11):2677-2684 |
| Databáze: | ScienceDirect |
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