Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
| Autor: | Dimcic, B., Labie, R., De Messemaeker, J., Vanstreels, K., Croes, K., Verlinden, B., De Wolf, I. |
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| Zdroj: | In Microelectronics Reliability September-October 2012 52(9-10):1971-1974 |
| Databáze: | ScienceDirect |
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